Section 13 of 104
11. Sensor, Smart Module and Data Integration
Stable section ID: S05-CON-016-SECTION-13 · 18 content blocks
System05 sensing shall be implemented through a modular architecture that avoids unnecessary distribution of complex electronics throughout the Building.
The preferred initial approach shall concentrate sensing intelligence, processing, communication, and replaceable electronics within accessible Smart Modules installed in selected Nodes or designated service locations.
A Smart Module may receive information from sensors or passive condition paths located elsewhere in the Node, Cartridge, Interface, Component, or Assembly. Such paths may include electrical continuity loops, low-energy conductors, fiber links, mechanical indicators, or other verified transmission methods.
The physical architecture shall therefore be designed to transport relevant condition information to a replaceable Smart Module without requiring the Module to be physically adjacent to every measured condition.
Smart Module integration shall address:
Cartridge-lock and Interface-state detection;
structural or environmental monitoring;
temperature, moisture, vibration, movement, or strain;
power condition and energy management;
tamper or unauthorized-access detection;
Module removal and replacement;
local storage and communications;
calibration and diagnostic status;
cybersecurity and permission boundaries.
Not every Node is required to be smart. The distribution strategy shall ensure sufficient observability of critical load paths, Interfaces, environmental conditions, and operational zones.
Where practical, each critical connection chain or monitored subsystem should terminate at or be observable by at least one Smart Node or equivalent monitored boundary.
Sensor data shall not be treated as verified truth without consideration of calibration, location, uncertainty, failure, drift, sampling, and provenance.
Failure of a Smart Module shall not create uncontrolled failure of the primary physical structure.